WAND Depaneling

As an extension of our tooling expertise, Larsen builds an elite punch and die based depaneling system for the printed circuit board industry. By greatly reducing and eliminating any stress or flex during the separation process of multiple populated PCB’s, the WAND Depaneling System safeguards against fractured joints and excess burrs, and leaves disjointed arrays quickly and cleanly separated. The WAND System is perfectly suited to accommodate medium to high volume PCB separation needs.

The Singulation Process 3016AT / 5016AT
The standard WAND DepanelingSingulation press is capable of punching individual or multiple populated panels within any specified working area. The operation is semi-automatic. Once the operator places the populated array into the “Depaneler”, a shuttle transports the tool into the enclosed cutting area for the separation. The bottom tool then returns to the operator, with the PCB board quickly and cleanly separated, and the cycle is complete.Total cycle time = 12.0

Tooling Change

Inherent in the design of the press, product changeover is complete in under 3 minutes.

Features

Air/Oil Power Pack
Quick Change Clamping
Die Package
Storage Elevator (Optional)
Air Logic Control
12 second cycle time
Fully Enclosed Structure
1 1/2” Maximum Component
Height including board thickness

Depaneler

The standard Singulation tool is capable of punching individual or multiple populated panels. Tooling weight less than 125 lbs.

Safety

Optical Touch Controls
Completely Guarded Cutting area
Two Anti-Repeat / Anti-Tie Down
Finger Controlled Start Mechanisms
Built In Safety Light Curtains
Package position sensors prevent power pack from cycling if package is out of position
(4) Pneumatic Clamps Lock upper Package in Position

WAND Depaneling System

System Brochure